삼원ACT(주)

1)Unlike the existing etching process of FPCB, a metal mold is manufactured and plated only on a fine pattern formed on the metal mold
by electroplating, and a fine pattern manufactured using a flexible film is transferred to form a fine pattern on the film.

2)Successfully commercialized for the first time in the world, replacing the existing FPCB manufacturing process.

3)New technology that is different from traditional FPCB manufacturing processes.

1)Circuit Cross section shape
- Existing Etching Process: 4 Sided Angle
- MPTP Electroplating : Arch
- Shape favorable for ultra-high frequency signal transmission in the GHz band

2)Control circuit properties
- Alloy plated circuit can be formed (Electrical resistance, strength adjustable)
- Multi-layer circuits can be formed (Circuit properties can be adjusted)

3)Scalability
- Applicable to various films other than polyimide
- Optimal combination of low permittivity film and adhesive(5G Communication Cable)
- Can be applied to a variety of products when combining circuit properties with transfer film

4)Cost competitiveness
- Sheet mold batch type: 20% cost reduction
- Continuous production of cylinder molds.: 40~50% cost reduction